Authors: Henri Ailas, Jaakko Saarilahti, Tuomas Pensala, Jyrki Kiihamäki
Published: 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Partner: VTT
Year of publishing: 2019
Title: Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror
Place of publication: Lyngby, Denmark