Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror | Henri Ailas, Jaakko Saarilahti, Tuomas Pensala, Jyrki Kiihamäki | 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) | 2019 | Visit |
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Title | Authors | Place of Publication | Year | Link |
Low-temperature Cu-Cu thermocompression bonding for encapsulation of a MEMS mirror | Henri Ailas, Jaakko Saarilahti, Tuomas Pensala, Jyrki Kiihamäki | 2019 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) | 2019 | Visit |
PRYSTINE has received funding within the Electronic Components and Systems for European Leadership Joint Undertaking (ECSEL JU) in collaboration with the European Union's H2020 Framework Programme and National Authorities, under grant agreement n° 783190